Patent Assignment
Reel/Frame 057151/0134
Assignment of Assignor's Interest
Recorded: 2021-08-11
Pages: 5
Assignors
CHOI, KWANG-SEONG
Executed: 2021-07-20
EOM, YONG SUNG
Executed: 2021-07-20
JOO, JIHO
Executed: 2021-07-20
CHOI, GWANG-MUN
Executed: 2021-07-20
MOON, SEOK-HWAN
Executed: 2021-07-20
LEE, CHANMI
Executed: 2021-07-20
JANG, KI SEOK
Executed: 2021-07-20
Assignee
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
218, GAJEONG-RO, YUSEONG-GU, DAEJEON, 34129, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor package with intermetallic-compound solder-joint comprising solder, UBM, and reducing layer materials