Patent Assignment
Reel/Frame 057154/0001
Assignment of Assignor's Interest
Recorded: 2021-08-11
Pages: 3
Assignors
LEE, CHING-HUA
Executed: 2021-08-10
FAN, MIAO-SYUAN
Executed: 2021-08-10
KUNG, TA-HSIANG
Executed: 2021-08-09
LEE, JUNG-WEI
Executed: 2021-08-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Channel Structures Including Doped 2D Materials for Semiconductor Devices