Patent Assignment
Reel/Frame 057170/0463
Assignment of Assignor's Interest
Recorded: 2021-08-13
Pages: 5
Assignors
LAI, BO-YU
Executed: 2021-05-05
LEE, CHIN-SZU
Executed: 2021-08-13
WU, SZU-HUA
Executed: 2021-05-04
LIANG, SHUEN-SHIN
Executed: 2021-05-04
CHU, CHIA-HUNG
Executed: 2021-05-21
LIN, KENG-CHU
Executed: 2021-05-04
WANG, SUNG-LI
Executed: 2021-05-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Conductive Feature of Semiconductor Device and Method of Forming Same