Patent Assignment
Reel/Frame 057188/0375
Assignment of Assignor's Interest
Recorded: 2021-08-16
Pages: 3
Assignors
MARUYAMA, HIDENOBU
Executed: 2021-06-03
MARUYAMA, KAZUNOBU
Executed: 2021-06-03
SUGANO, MASATO
Executed: 2021-06-03
Assignee
SEIKO EPSON CORPORATION
1-6, SHINJUKU 4-CHOME, SHINJUKU-KU, TOKYO, 160-8801, JAPAN
Covered Property
(1)
Injection Molding System