IP Library › Granted Patent US 11,931,933
Granted Patent B2
US 11,931,933 · App. 17/402,880 · Granted Mar 19, 2024

Injection molding system

Inventors: Hidenobu Maruyama (Azumino, JP); Kazunobu Maruyama (Shiojiri, JP); Masato Sugano (Shiojiri, JP)
Assignee: Seiko Epson Corporation
B29C45/0416B29C45/1769B29C45/401B29C45/60B29C45/62B29C2045/0096B29C2945/76531
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Quick Facts
Patent No.
US 11,931,933
App. No.
17/402,880
Granted
Mar 19, 2024
Kind
B2
Abstract

An injection molding system includes a first unit in which an injection molding machine is disposed and an option unit. The injection molding machine is configured to be attachable with a stationary die and a movable die that moves with respect to the stationary die. The option unit includes at least one of a second unit in which a robot that moves a molded article molded by the injection molding machine is disposed and a third unit in which at least one of a material dryer that dries a material supplied to the injection molding machine and a material supply section that supplies the material to the injection molding machine is disposed. The first unit is configured to be detachably attachable with the option unit.

Claims (36)

1. An injection molding system comprising:

a first unit in which an injection molding machine is disposed; and

an option unit, wherein

the injection molding machine is configured to be attachable with a stationary die and a movable die that moves with respect to the stationary die,

the option unit includes:

a second unit in which a robot that moves a molded article molded by the injection molding machine is disposed; and

a third unit in which at least one of a material dryer is configured to dry a material supplied to the injection molding machine and a material supply section that supplies the material to the injection molding machine is disposed, and

the first unit is configured to be detachably attachable with the option unit.

2. The injection molding system according to claim 1 , wherein

the option unit includes the second unit, and

in a state in which the stationary die and the movable die are attached to the injection molding machine, a distance between the second unit and the movable die is shorter than a distance between the second unit and the stationary die.

3. The injection molding system according to claim 1 , wherein

the option unit includes the third unit, and

in a state in which the stationary die and the movable die are attached to the injection molding machine, a distance between the third unit and the stationary die is shorter than a distance between the third unit and the movable die.

4. The injection molding system according to claim 1 , wherein

the first unit includes:

a taking-out device configured to take out the molded article from the injection molding machine; and

a transporting device configured to transport the molded article taken out by the taking-out device, and

the robot disposed in the second unit moves the molded article transported by the transporting device.

5. The injection molding system according to claim 1 , wherein

the option unit includes the second unit,

the second unit includes an inspection unit configured to inspect the molded article, and

the robot moves the molded article from the first unit to the inspection unit.

6. The injection molding system according to claim 1 , wherein, in the first unit, the injection molding machine and a controller that controls the injection molding machine are disposed side by side in a vertical direction.

7. The injection molding system according to claim 1 , wherein

the option unit includes the third unit, and

the third unit includes a temperature controller for adjusting temperature of a molding die included in the injection molding machine.

8. The injection molding system according to claim 1 , wherein the injection molding machine includes an ejector pin configured to, in a state in which the stationary die and the movable die are attached to the injection molding machine, project from the movable die toward the stationary die according to the movement of the movable die to thereby extrude the molded article from the movable die.

9. The injection molding system according to claim 1 , wherein

the material supply unit supplies the material from the material dryer to the injection molding machine.

10. The injection molding system according to claim 1 , wherein

a position of the second unit is in relation to the first unit is fixed by a stopper extending downwardly from a bottom portion of the second unit and a coupling plate-like member extending between the first unit and the second unit and between the robot and a stacking mechanism for the second unit.

11. The injection molding system according to claim 1 , further comprising:

a first controller and a second controller disposed in the first unit, the first controller being configured to control the injection molding machine,

the injection molding machine being configured to be attachable with a molding die having a stationary die and a movable die that moves with respect to the stationary die, the second controller being configured to control a heat medium circulating to the molding die, and

the third unit comprising a hot runner controller configured to adjust a temperature of a nozzle of the injection molding machine and a heat medium temperature controller configured to cool the head medium circulating to the molding die.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 16, 2021
From: MARUYAMA, HIDENOBU; MARUYAMA, KAZUNOBU; SUGANO, MASATO
To: SEIKO EPSON CORPORATION
Reel/Frame 057188/0375 →
Priority Claims (1)
JP 2020-138508 · Aug 19, 2020 · national
Continuity (1)
Related Publication 20220055268A1 · Feb 24, 2022