Patent Assignment
Reel/Frame 057207/0053
Assignment of Assignor's Interest
Recorded: 2021-08-17
Pages: 6
Assignors
CHOI, IN-HYUK
Executed: 2021-07-22
LEE, WONCHUL
Executed: 2021-07-22
YANG, JOONHYOUNG
Executed: 2021-07-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Fabricating Same