Patent Assignment
Reel/Frame 057221/0479
Assignment of Assignor's Interest
Recorded: 2021-08-19
Pages: 10
Assignors
CHIANG, CHUNG-SUNG
Executed: 2021-08-05
LIU, CHIA-WEI
Executed: 2021-08-05
CHEN, YU-RUEI
Executed: 2021-08-11
LIN, YU-HSIANG
Executed: 2021-08-05
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Bonded Semiconductor Structure Utilizing Concave/Convex Profile Design for Bonding Pads