Patent Assignment
Reel/Frame 057236/0136
Assignment of Assignor's Interest
Recorded: 2021-08-19
Pages: 4
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANZIH DIST., KAOHSIUNG, 811, TAIWAN
Covered Property
(1)
Electronic Package and Method of Manufacturing the Same