IP Library Granted Patent US 11,888,210
Granted Patent B2
US 11,888,210 · App. 17/396,601 · Granted Jan 30, 2024

Electronic package and method of manufacturing the same

Inventors: Jenchun Chen (Kaohsiung, TW); Ya-Wen Liao (Kaohsiung, TW)
Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
H01Q1/2283H01L23/66H01Q1/40H01Q1/422H01Q9/0414H01Q21/065H01Q21/08H01L2223/6677H01L2223/6688
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Quick Facts
Patent No.
US 11,888,210
App. No.
17/396,601
Granted
Jan 30, 2024
Kind
B2
Abstract

The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.

Claims (22)

1. An electronic package, comprising:

an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna; and

a directing element covering the antenna structure, the directing element having a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna,

wherein the first portion of the directing element has an area larger than an area of the first antenna and less than an area of the second antenna.

2. The electronic package of claim 1 , wherein the antenna structure comprises a first dielectric layer covering the first antenna and a second dielectric layer, on which the first dielectric layer is disposed, covering the second antenna.

3. The electronic package of claim 2 , wherein a dielectric constant (Dk) of each of the first portion and the second portion of the directing element is higher than the first dielectric layer and the second dielectric layer.

4. The electronic package of claim 1 , wherein the first antenna has a width less than a width of the second antenna.

5. The electronic package of claim 1 , wherein a width of a projection of the directing element on the second antenna is substantially equal to a width of the second antenna.

6. The electronic package of claim 1 , wherein the second portion of the directing element is around the first portion of the directing element.

7. The electronic package of claim 1 , wherein the antenna structure further comprises a plurality of first regions and a second region, wherein the directing element covers the plurality of first regions, and wherein the plurality of first regions are separated from each other by the second region.

8. The electronic package of claim 1 , wherein the first antenna is configured to operate with an operating frequency higher than an operating frequency of the second antenna.

9. The electronic package of claim 8 , wherein a Dk of the first portion of the directing element is higher than a Dk of the second portion of the directing element.

10. The electronic package of claim 2 , wherein a lateral surface of the directing element is misaligned with a lateral surface of the first dielectric layer or a lateral surface of the second dielectric layer.

11. The electronic package of claim 1 , wherein the first portion of the directing element is configured to guide the first electromagnetic wave radiated from the first antenna to an outside of the electronic package.

12. The electronic package of claim 1 , wherein the second portion of the directing element is configured to guide the second electromagnetic wave radiated from the second antenna to an outside of the electronic package.

13. The electronic package of claim 1 , wherein a surface of the first portion of the directing element facing away from the antenna structure is substantially aligned with a surface of the second portion of the directing element facing away from the antenna structure.

14. An electronic package, comprising:

an antenna structure having a first region and a second region; and

a directing element covering the first region of the antenna structure and exposing a part of the second region of the antenna structure, the directing element having a first portion configured to direct a first electromagnetic wave having a first frequency to transmit within the first portion and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit within the second portion,

wherein the antenna structure comprises a first antenna and a second antenna within the first region, and wherein the first antenna is disposed between the direction element and the second antenna, and

wherein a width of a projection of the first portion of the directing element on the second antenna is less than a width of the second antenna.

15. The electronic package of claim 14 , wherein the antenna structure further comprises a plurality of first regions separated from each other by the second region.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 19, 2021
From: CHEN, JENCHUN; LIAO, YA-WEN
To: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 057236/0136 →
Continuity (1)
Related Publication 20230037915A1 · Feb 9, 2023
Cited By (1)
US 12,374,778