IP Library Granted Patent US 12,374,778
Granted Patent B2
US 12,374,778 · App. 18/427,788 · Granted Jul 29, 2025

Electronic package and method of manufacturing the same

Inventors: Jenchun Chen (Kaohsiung, TW); Ya-Wen Liao (Kaohsiung, TW)
Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
H01Q1/2283H01Q1/40H01Q9/0414H01Q21/065H01Q21/08
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Quick Facts
Patent No.
US 12,374,778
App. No.
18/427,788
Granted
Jul 29, 2025
Kind
B2
Abstract

The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.

Claims (36)

1. An electronic package, comprising:

an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna; and

a directing element covering the antenna structure, the directing element having a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna,

wherein the directing element has a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna,

wherein the first portion and the second portion are at least partially vertically overlapped, and

wherein the first portion of the directing element has an area larger than an area of the first antenna and less than an area of the second antenna.

2. The electronic package of claim 1 , wherein the antenna structure comprises:

a first dielectric layer contacting a lateral side of the first antenna; and

a second dielectric layer contacting a lateral side of the second antenna.

3. The electronic package of claim 2 , wherein a width of the first dielectric layer is substantially equal to a width of a second portion of the directing element.

4. The electronic package of claim 2 , wherein the first dielectric layer is spaced apart from the first portion of the directing element.

5. The electronic package of claim 2 , wherein the first dielectric layer is connected to the second dielectric layer.

6. The electronic package of claim 2 , wherein a dielectric constant (Dk) of the first portion of the directing element is greater than a Dk of the first dielectric layer and greater than a Dk of the second dielectric layer.

7. An electronic package, comprising:

an antenna structure having a first antenna and a second antenna;

a directing element including:

a first portion having a first dielectric constant (Dk); and

a second portion having a second Dk different from the first Dk,

wherein the first portion is configured to direct a first electromagnetic wave via the first antenna, and

wherein the second portion is configured to direct a second electromagnetic wave via the second antenna.

8. The electronic package of claim 7 , wherein the first antenna is configured to operate at a first frequency and the second antenna is configured to operate at a second frequency lower than the first frequency.

9. The electronic package of claim 8 , wherein the first antenna is disposed between the second antenna and the directing element.

10. The electronic package of claim 7 , wherein each of the first portion and the second portion include a dielectric material.

11. The electronic package of claim 7 , wherein the second portion is disposed between the first portion and the antenna structure, and wherein the first Dk is greater than the second Dk.

12. The electronic package of claim 11 , wherein a width of the first portion is less than a width of the second portion.

13. The electronic package of claim 11 , wherein the first Dk is at least twice as much as the second Dk.

14. An electronic package, comprising:

an antenna structure having a first antenna and a second antenna; and

a directing element including:

a first portion configured to direct a first electromagnetic wave transmitted by the first antenna; and

a second portion configured to direct a second electromagnetic wave transmitted by the second antenna; and

wherein a width of a projection of the first portion of the directing element on the second antenna is less than a width of the second antenna, and

wherein the second portion is vertically covered by the first portion.

15. The electronic package of claim 14 , wherein the width of the projection of the first portion of the directing element on the second antenna is substantially equal to a width of the first portion.

16. The electronic package of claim 14 , further comprising:

a dielectric layer encapsulating the first antenna, wherein a lateral surface of the dielectric layer is substantially aligned with a lateral surface of the second portion.

Continuity (2)
Continuation 17396601 · Aug 6, 2021
Related Publication 20240170829A1 · May 23, 2024
References Cited (6)
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Notice of Allowance for U.S. Appl. No. 17/396,601, issued Sep. 20, 2023, 5 pages. [cited by applicant]