Patent Assignment
Reel/Frame 057256/0006
Assignment of Assignor's Interest
Recorded: 2021-08-23
Pages: 5
Assignors
ZENG, XINRU
Executed: 2019-09-24
CHEN, PENG
Executed: 2019-09-24
ZHOU, HOUDE
Executed: 2019-09-24
Assignee
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
ROOM 7018, NO 18, HUAGUANG BOULEVARD, GUANGDONG TECH. INDUSTRIAL PARK, DONGHUA DEVELOPMENT AREA,, HONGSHAN DISTRICT, WUHAN CITY, HUBEI, 430074, CHINA
Covered Property
(1)
Chip Package Structure and Manufacturing Method Thereof