Patent Assignment
Reel/Frame 057266/0417
Assignment of Assignor's Interest
Recorded: 2021-08-24
Pages: 2
Assignor
ICHINOSE, DAIGO
Executed: 2021-08-19
Assignee
KIOXIA CORPORATION
1-21, SHIBAURA 3-CHOME, MINATO-KU, TOKYO, 108-0023, JAPAN
Covered Property
(1)
Three-dimensional memory stack structure with source line including an insulating dividing portion