Three-dimensional memory stack structure with source line including an insulating dividing portion
According to one embodiment, a semiconductor storage device includes a stacked body, a columnar body, a conductive member, a plate-like portion, and a dividing portion. In the stacked body, a plurality of conductive layers and a plurality of insulating layers are alternately stacked one by one, and a stepped portion including the conductive layers is formed to be faced to an end in a first direction. The columnar body penetrates the stacked body, and includes a memory cell formed in a portion facing the conductive layer. The conductive member is electrically connected to the columnar body below the stacked body, and extends to a region laterally below the stacked body beyond the stepped portion in the first direction. The plate-like portion extends in a stacking direction of the stacked body in a lateral region of the stacked body to reach the conductive member, and extends in a second direction intersecting the first direction. The dividing portion is disposed in the conductive member on the stepped portion side with respect to the plate-like portion, partially divides the conductive member, and includes an insulating material.
1. A semiconductor storage device comprising:
a stacked body in which a plurality of conductive layers and a plurality of insulating layers are alternately stacked one by one, and a stepped portion including the conductive layers is formed to be faced to an end in a first direction;
a columnar body penetrating the stacked body and including a memory cell formed in a portion facing at least one of the conductive layers;
a conductive member electrically connected to the columnar body below the stacked body and extending to a region laterally below the stacked body beyond the stepped portion in the first direction;
a plate-like portion extending in a stacking direction of the stacked body in a lateral region of the stacked body to reach the conductive member, and extending in a second direction intersecting the stacking direction and the first direction; and
a dividing portion disposed in the conductive member on the stepped portion side with respect to the plate-like portion, the dividing portion partially dividing the conductive member, and including an insulating material, wherein
the conductive member includes:
a first portion electrically connected to the columnar body; and
a second portion extending from the first portion to the stepped portion side in the first direction, and
the second portion includes:
a first layer electrically conducting with the first portion; and
a third layer provided above the first layer with an insulating second layer interposed therebetween and electrically conducting with the first portion.
2. The semiconductor storage device according to claim 1 , wherein
the plate-like portion extending in the stacking direction terminates in the first layer, and
the dividing portion is provided in the first layer.
3. The semiconductor storage device according to claim 1 , wherein
the plate-like portion extending in the stacking direction terminates in the third layer, and
the dividing portion is provided in the third layer.
4. The semiconductor storage device according to claim 1 ,
wherein the dividing portion is provided in the first layer and the third layer.
5. The semiconductor storage device according to claim 1 , wherein
an extending length in the first direction of the third layer is shorter than an extending length in the first direction of the first layer,
an end in the first direction of the third layer is separated from the plate-like portion, and
the dividing portion is provided in the first layer.
6. The semiconductor storage device according to claim 1 , wherein the dividing portion intermittently extends in the second direction.
7. The semiconductor storage device according to claim 1 , wherein the dividing portion is arranged in two columns in the first direction while intermittently extending in the second direction, and the dividing portion of the two columns is shifted from each other in the second direction between the columns.
8. The semiconductor storage device according to claim 1 , wherein the plate-like portion is arranged in two columns side by side in the first direction.
9. The semiconductor storage device according to claim 1 , wherein the plate-like portion is disposed at a position within 5 μm in the first direction from the end in the first direction of the stacked body.
10. The semiconductor storage device according to claim 1 , wherein the dividing portion includes a same insulating material as an insulating film disposed below the conductive member.
11. The semiconductor storage device according to claim 10 , further comprising a wiring layer disposed below the conductive member via the insulating film.
12. The semiconductor storage device according to claim 1 , wherein
an extending length in the first direction of the first layer is shorter than an extending length in the first direction of the third layer,
the plate-like portion extending in the stacking direction reaches a portion of the third layer extending in the first direction beyond the first layer, and
the dividing portion is provided in the third layer.
13. The semiconductor storage device according to claim 12 , wherein the plate-like portion terminates in an insulating layer disposed below the third layer.
14. The semiconductor storage device according to claim 13 , wherein the insulating layer disposed below the third layer includes a same insulating material as an insulating film disposed below the first layer.