Patent Assignment
Reel/Frame 057275/0483
Assignment of Assignor's Interest
Recorded: 2021-08-24
Pages: 2
Assignors
GUO, TA-PEN
Executed: 2019-10-17
TIEN, LI-CHUN
Executed: 2019-10-19
CHEN, CHIEN-YING
Executed: 2019-10-17
LU, LEE-CHUNG
Executed: 2019-10-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Forming Semiconductor Device Including Deep Vias