Patent Assignment
Reel/Frame 057277/0856
Assignment of Assignor's Interest
Recorded: 2021-08-24
Pages: 4
Assignor
UCHIDA, YOHEI
Executed: 2021-07-22
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Capillary Guide Device and Wire Bonding Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.