Patent Assignment
Reel/Frame 057299/0197
Assignment of Assignor's Interest
Recorded: 2021-08-26
Pages: 4
Assignors
CHEN, HAN-DE
Executed: 2020-12-15
TENG, YU CHEN
Executed: 2020-12-15
TSAI, CHENG-FONG
Executed: 2020-12-15
SHEU, JYH-CHERNG
Executed: 2020-12-15
CHANG, HUICHENG
Executed: 2020-12-15
YEO, YEE-CHIA
Executed: 2020-12-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Wafer Bonding System and Method of Using the Same