Patent Assignment
Reel/Frame 057300/0991
Assignment of Assignor's Interest
Recorded: 2021-08-26
Pages: 3
Assignors
WU, JIUN YI
Executed: 2020-12-01
YU, CHEN-HUA
Executed: 2020-12-01
LIU, CHUNG-SHI
Executed: 2020-12-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method