Patent Assignment
Reel/Frame 057302/0388
Assignment of Assignor's Interest
Recorded: 2021-08-26
Pages: 4
Assignors
CHANG, JEN-YUAN
Executed: 2021-01-26
LEE, CHIEN-CHANG
Executed: 2021-01-27
LAI, CHIA-PING
Executed: 2021-01-09
TSAI, TZU-CHUNG
Executed: 2021-01-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Three-Dimensional Device Structure Including Substrate-Embedded Integrated Passive Device and Methods for Making the Same