Patent Assignment
Reel/Frame 057309/0239
Assignment of Assignor's Interest
Recorded: 2021-08-27
Pages: 6
Assignors
CHEN, GANG
Executed: 2021-08-13
ZHANG, YI
Executed: 2021-08-02
YAN, FENGYUN
Executed: 2021-08-20
Assignee
GIGADEVICE SEMICONDUCTOR (BEIJING) INC.
BULDING NO. 8, IC PARK NO. 9, FENGHAO EAST ROAD, HAIDIAN, BEIJING, 100088, CHINA
Covered Property
(1)
Image Sensor Pixel with Deep Trench Isolation Structure
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Receiving Party Street Address Previously Recorded at Reel: 059309 Frame: 0239. Assignor(S) Hereby Confirms the Assignment.
May 19, 2022
From: CHEN, GANG; ZHANG, YI; YAN, FENGYUN
To: GIGADEVICE SEMICONDUCTOR (BEIJING) INC.
Reel/Frame 060384/0369 →
Assignment of Assignor's Interest
Aug 26, 2022
From: GIGADEVICE SEMICONDUCTOR (BEIJING) INC.
To: MAGVISION SEMICONDUCTOR (BEIJING) INC.
Reel/Frame 060914/0423 →