Patent Assignment
Reel/Frame 060914/0423
Assignment of Assignor's Interest
Recorded: 2022-08-26
Pages: 5
Assignor
GIGADEVICE SEMICONDUCTOR (BEIJING) INC.
Executed: 2022-08-16
Assignee
MAGVISION SEMICONDUCTOR (BEIJING) INC.
BUILDING NO. 6, NO.10 KEGU ONE STREET, ECONOMIC-TECHNOLOGICAL DEVELOPMENT AREA, BEIJING, 100176, CHINA
Covered Properties
(5)
Image Sensor Pixel with Deep Trench Isolation Structure
Image Sensor Pixel with Deep Trench Isolation Structure
Deep Trench Isolation Structure for Image Sensor
Image Sensor Pixel with Deep Trench Isolation Structure
Image Sensor Pixel with Deep Trench Isolation Structure
Application:
63/226,509 →
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 27, 2021
From: CHEN, GANG; ZHANG, YI; YAN, FENGYUN
To: GIGADEVICE SEMICONDUCTOR (BEIJING) INC.
Reel/Frame 057309/0239 →
Assignment of Assignor's Interest
Sep 2, 2021
From: CHEN, GANG; ZHANG, YI; YAN, FENGYUN
To: GIGADEVICE SEMICONDUCTOR (BEIJING) INC.
Reel/Frame 057374/0607 →
Assignment of Assignor's Interest
Sep 16, 2021
From: CHEN, GANG
To: GIGADEVICE SEMICONDUCTOR (BEIJING) INC.
Reel/Frame 057504/0831 →
Assignment of Assignor's Interest
Sep 17, 2021
From: CHEN, GANG; PANG, CHIN POH
To: GIGADEVICE SEMICONDUCTOR (BEIJING) INC.
Reel/Frame 057519/0670 →
Assignment of Assignor's Interest
Oct 21, 2021
From: CHEN, GANG
To: GIGADEVICE SEMICONDUCTOR (BEIJING) INC.
Reel/Frame 057863/0668 →
Corrective Assignment to Correct the Receiving Party Street Address Previously Recorded at Reel: 059309 Frame: 0239. Assignor(S) Hereby Confirms the Assignment.
May 19, 2022
From: CHEN, GANG; ZHANG, YI; YAN, FENGYUN
To: GIGADEVICE SEMICONDUCTOR (BEIJING) INC.
Reel/Frame 060384/0369 →