Patent Assignment
Reel/Frame 057374/0607
Assignment of Assignor's Interest
Recorded: 2021-09-02
Pages: 6
Assignors
CHEN, GANG
Executed: 2021-08-13
ZHANG, YI
Executed: 2021-08-02
YAN, FENGYUN
Executed: 2021-08-20
Assignee
GIGADEVICE SEMICONDUCTOR (BEIJING) INC.
BUILDING NO.8, IC PARK, NO.9 FENGHAO EAST ROAD, HAIDIAN, BEIJING, 100088, CHINA
Covered Property
(1)
Image Sensor Pixel with Deep Trench Isolation Structure
Application:
63/226,509 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.