IP Library › Assignment 057519/0670
Patent Assignment
Reel/Frame 057519/0670

Assignment of Assignor's Interest

Recorded: 2021-09-17 Pages: 4
Assignors
CHEN, GANG
Executed: 2021-09-14
PANG, CHIN POH
Executed: 2021-09-15
Assignee
GIGADEVICE SEMICONDUCTOR (BEIJING) INC.
BUILDING NO.8, IC PARK, NO.9, FENGHAO EAST ROAD, HAIDIAN, BEIJING, 100088, CHINA
Covered Property (1)
Deep Trench Isolation Structure for Image Sensor
Application: 17/478,556 →
Publication: US 2023/0089511
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 26, 2022
From: GIGADEVICE SEMICONDUCTOR (BEIJING) INC.
To: MAGVISION SEMICONDUCTOR (BEIJING) INC.
Reel/Frame 060914/0423 →