IP Library › Assignment 057863/0668
Patent Assignment
Reel/Frame 057863/0668

Assignment of Assignor's Interest

Recorded: 2021-10-21 Pages: 3
Assignor
CHEN, GANG
Executed: 2021-10-20
Assignee
GIGADEVICE SEMICONDUCTOR (BEIJING) INC.
BUILDING NO. 8, IC PARK, NO. 9, FENGHAO EAST ROAD, HAIDIAN, BEIJING, 100088, CHINA
Covered Property (1)
Image Sensor Pixel with Deep Trench Isolation Structure
Application: 17/506,947 →
Publication: US 2023/0131599
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 26, 2022
From: GIGADEVICE SEMICONDUCTOR (BEIJING) INC.
To: MAGVISION SEMICONDUCTOR (BEIJING) INC.
Reel/Frame 060914/0423 →