Patent Assignment
Reel/Frame 057310/0138
Assignment of Assignor's Interest
Recorded: 2021-08-27
Pages: 4
Assignors
YOUNG, BO-FENG
Executed: 2021-02-11
YEONG, SAI-HOOI
Executed: 2021-02-13
LIN, YU-MING
Executed: 2021-02-17
CHUI, CHI ON
Executed: 2021-02-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Memory Device and Method of Forming Thereof