Patent Assignment
Reel/Frame 057327/0655
Assignment of Assignor's Interest
Recorded: 2021-08-30
Pages: 4
Assignors
LAI, PO-CHEN
Executed: 2021-01-07
YEW, MING-CHIH
Executed: 2021-01-10
LIAO, LI-LING
Executed: 2021-01-17
WANG, CHIN-HUA
Executed: 2021-01-07
LIN, PO-YAO
Executed: 2021-01-07
JENG, SHIN-PUU
Executed: 2021-01-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method for Forming the Same