Patent Assignment
Reel/Frame 057330/0888
Assignment of Assignor's Interest
Recorded: 2021-08-30
Pages: 6
Assignors
JUNG, YANGGYOO
Executed: 2021-07-05
KIM, SUNGEUN
Executed: 2021-07-06
YONG, SANGMIN
Executed: 2021-07-06
YU, HAE-JUNG
Executed: 2021-07-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package with Memory Stack Structure Connected to Logic Dies via an Interposer