Semiconductor package with memory stack structure connected to logic dies via an interposer

1. A semiconductor package, comprising:

a package substrate that extends in a first direction and a second direction perpendicular to the first direction;

a plurality of logic dies and a memory stack structure on the package substrate; and

an interposer substrate mounted in the package substrate,

wherein the entirety of the memory stack structure vertically overlaps the interposer substrate,

wherein each of the logic dies includes:

a first part that is horizontally offset from the interposer substrate; and

a plurality of first connection terminals that electrically connect the logic dies to the package substrate; and

a plurality of second connection terminals that electrically connect the logic dies to the interposer substrate; and

a second part that vertically overlaps the interposer substrate,

wherein the interposer substrate includes:

an interlayer dielectric layer; and

a plurality of wiring lines in the interlayer dielectric layer, and

wherein the memory stack structure is electrically connected to at least one of the logic dies through the wiring lines of the interposer substrate,

wherein a bottom surface of the interposer substrate is in contact with the package substrate, and

wherein the interposer substrate does not include a conductive structure providing an electrical connection between the wiring lines of the interposer substrate and the bottom surface of the interposer substrate.

2. The semiconductor package of claim 1 , wherein, when viewed in a plan view, the package substrate has a plurality of edge regions and a central region between the edge regions,

wherein the logic dies are on the edge regions, and

wherein the memory stack structure is on the central region.

3. The semiconductor package of claim 1 , wherein

a width of the second part in the second direction has a value selected from a range of about 0.5 mm to about 5 mm, and

a width of the first part in the second direction is greater than the width of the second part in the second direction.

4. The semiconductor package of claim 1 ,

wherein a pitch between the first connection terminals is greater than a pitch between the second connection terminals.

5. The semiconductor package of claim 4 , wherein

the pitch between the first connection terminals has a value selected from a range of about 50 μm to about 200 μm, and

the pitch between the second connection terminals has a value selected from a range of about 40 μm to about 50 μm.

6. The semiconductor package of claim 4 , further comprising a plurality of third connection terminals that electrically connect the memory stack structure to the interposer substrate,

wherein a pitch between the third connection terminals is the same as the pitch between the second connection terminals.

7. The semiconductor package of claim 1 , wherein the interposer substrate further includes a capacitor in the interlayer dielectric layer.

8. The semiconductor package of claim 1 , wherein the memory stack structure includes:

a buffer die; and

a plurality of memory dies that are stacked on the buffer die,

wherein the buffer die is mounted in the interposer substrate.

9. The semiconductor package of claim 8 , wherein a top surface of the buffer die is at the same level as a level of a top surface of the interposer substrate.

10. The semiconductor package of claim 1 , further comprising a plurality of memory stack structures,

wherein, when viewed in plan, the plurality of memory stack structures are between the logic dies.

11. A semiconductor package, comprising:

a package substrate that extends in a first direction and a second direction perpendicular to the first direction and that includes, when viewed in a plan view, a plurality of edge regions and a central region between the edge regions;

a plurality of logic dies and a memory stack structure on the package substrate, the logic dies being on the edge regions, and the memory stack structure being on the central region;

an interposer substrate including wiring lines mounted in the package substrate, the wiring lines electrically connecting the memory stack structure to at least one of the logic dies;

a plurality of first connection terminals that electrically connect the logic dies to the package substrate;

a plurality of second connection terminals that electrically connect the logic dies to the interposer substrate; and

a plurality of third connection terminals that electrically connect the memory stack structure to the interposer substrate,

wherein a pitch between the first connection terminals is greater than a pitch between the second connection terminals,

wherein the pitch between the first connection terminals is greater than a pitch of the third connection terminals,

wherein a bottom surface of the interposer substrate is in contact with the package substrate,

wherein the interposer substrate does not include a conductive structure providing an electrical connection between the wiring lines of the interposer substrate and the bottom surface of the interposer substrate, and

wherein the entirety of the memory stack structure vertically overlaps the interposer substrate.

12. The semiconductor package of claim 11 , wherein

the pitch between the first connection terminals has a value selected from a range of about 50 μm to about 200 μm, and

wherein the pitch between the second connection terminals and the pitch between the third connection terminals have a value selected from a range of about 40 μm to about 50 μm.

13. The semiconductor package of claim 11 , wherein each of the logic dies includes:

a first part that is horizontally offset from the interposer substrate; and

a second part that vertically overlaps the interposer substrate,

wherein a width of the first part in the second direction is greater than a width of the second part in the second direction.

14. The semiconductor package of claim 11 , further comprising a molding layer that covers sidewalls of the logic dies and sidewalls of the memory stack structure.

15. The semiconductor package of claim 11 , further comprising a plurality of memory stack structures,

wherein the entirety of each of the plurality of memory stack structures vertically overlap the interposer substrate.

16. A semiconductor package, comprising:

a package substrate that extends in a first direction and a second direction perpendicular to the first direction and that includes a plurality of edge regions and a central region between the edge regions;

an interposer substrate mounted in the package substrate;

a dielectric film between the package substrate and the interposer substrate;

a plurality of logic dies on the plurality of edge regions of the package substrate;

a memory stack structure on the central region of the package substrate, the memory stack structure including a buffer die and a plurality of memory dies that are stacked on the buffer die;

a plurality of first connection terminals between the package substrate and the logic dies;

a plurality of second connection terminals between the interposer substrate and the logic dies;

a plurality of third connection terminals between the memory stack structure and the interposer substrate;

a plurality of pads on lower portions of the first, second, and third connection terminals;

an under-fill layer that encapsulates the first, second, and third connection terminals; and

a plurality of external terminals on a bottom surface of the package substrate,

wherein the interposer substrate includes:

a base substrate;

an interlayer dielectric layer on the base substrate;

a plurality of wiring lines in the interlayer dielectric layer; and

a plurality of vias in the interlayer dielectric layer, the plurality of vias electrically connecting the wiring lines to each other,

wherein the memory stack structure and at least one of the logic dies are electrically connected to each other through the wiring lines of the interposer substrate,

wherein the entirety of the memory stack structure vertically overlaps the interposer substrate,

wherein each of the logic dies includes:

a first part that is horizontally offset from the interposer substrate; and

a second part that vertically overlaps the interposer substrate,

wherein a bottom surface of the interposer substrate is in contact with the package substrate, and

wherein the interposer substrate does not include a conductive structure providing an electrical connection between the wiring lines of the interposer substrate and the bottom surface of the interposer substrate.

17. The semiconductor package of claim 16 , wherein

a width of the second part in the second direction has a value selected from a range of about 0.5 mm to about 5 mm, and

a width of the first part in the second direction is greater than the width of the second part.

18. The semiconductor package of claim 16 , wherein

a pitch between the first connection terminals is greater than a pitch between the second connection terminals and a pitch between the third connection terminals, and

a pitch between the external terminals is greater than the pitch between the first connection terminals.

19. The semiconductor package of claim 16 , wherein the interposer substrate further includes a capacitor in the interlayer dielectric layer.

20. The semiconductor package of claim 16 , further comprising:

a thermal radiation plate on the logic dies and the memory stack structure; and

a molding layer that covers sidewalls of the logic dies and sidewalls of the memory stack structure.