Patent Assignment
Reel/Frame 057332/0740
Assignment of Assignor's Interest
Recorded: 2021-08-30
Pages: 3
Assignor
CHANG, JEN-YUAN
Executed: 2021-05-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Semiconductor Package Including Test Pad and Bonding Pad Structure for Die Connection and Methods for Forming the Same