Patent Assignment
Reel/Frame 057342/0129
Assignment of Assignor's Interest
Recorded: 2021-08-31
Pages: 3
Assignors
LIN, SHIH-YAO
Executed: 2021-03-03
LEE, HSIAO WEN
Executed: 2021-05-09
CHEN, CHAO-CHENG
Executed: 2021-02-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Devices and Methods of Manufacturing Thereof