Patent Assignment
Reel/Frame 057346/0846
Assignment of Assignor's Interest
Recorded: 2021-08-31
Pages: 5
Assignors
NAGAYA, MASATAKE
Executed: 2021-07-27
KUMAZAWA, TERUAKI
Executed: 2021-07-29
NAGUMO, YUJI
Executed: 2021-07-28
HIRATA, KAZUYA
Executed: 2021-07-29
NOMOTO, ASAHI
Executed: 2021-07-27
Assignees
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-CITY, AICHI-PREF., 448-8661, JAPAN
TOYOTA JIDOSHA KABUSHIKI KAISHA
1, TOYOTA-CHO, TOYOTA-SHI, AICHI-KEN, 471-8571, JAPAN
MIRISE TECHNOLOGIES CORPORATION
500-1 MINAMIYAMA, KOMENOKI-CHO, NISSHIN-SHI, AICHI-KEN, 470-0111, JAPAN
DISCO CORPORATION
13-11 OMORI-KITA 2-CHOME, OTA-KU, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Processed Wafer and Method of Manufacturing Chip Formation Wafer