Patent Assignment
Reel/Frame 057370/0031
Assignment of Assignor's Interest
Recorded: 2021-09-02
Pages: 4
Assignors
CHANG, MINGNI
Executed: 2021-08-27
TSOU, YUN-CHIN
Executed: 2021-08-29
WU, CHING-JING
Executed: 2021-08-25
CHEN, SHIOU-FAN
Executed: 2021-08-29
WANG, MING-YIH
Executed: 2021-08-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Dummy Stacked Structures Surrounding TSVS and Method Forming the Same