Dummy stacked structures surrounding TSVs and method forming the same
A method includes forming a plurality of low-k dielectric layers over a semiconductor substrate, forming a first plurality of dummy stacked structures extending into at least one of the plurality of low-k dielectric layers, forming a plurality of non-low-k dielectric layers over the plurality of low-k dielectric layers, and forming a second plurality of dummy stacked structures extending into the plurality of non-low-k dielectric layers. The second plurality of dummy stacked structures are over and connected to corresponding ones of the first plurality of dummy stacked structures. The method further includes etching the plurality of non-low-k dielectric layers, the plurality of low-k dielectric layers, and the semiconductor substrate to form a via opening. The via opening is encircled by the first plurality of dummy stacked structures and the second plurality of dummy stacked structures. The via opening is then filled to form a through-via.
1. A method comprising:
forming a plurality of low-k dielectric layers over a semiconductor substrate;
forming a first plurality of dummy stacked structures extending into at least one of the plurality of low-k dielectric layers;
forming a plurality of non-low-k dielectric layers over the plurality of low-k dielectric layers;
forming a second plurality of dummy stacked structures extending into the plurality of non-low-k dielectric layers, wherein the second plurality of dummy stacked structures are over and connected to corresponding ones of the first plurality of dummy stacked structures;
etching the plurality of non-low-k dielectric layers, the plurality of low-k dielectric layers, and the semiconductor substrate to form a via opening, wherein the via opening is encircled by the first plurality of dummy stacked structures and the second plurality of dummy stacked structures; and
filling the via opening to form a through-via.
2. The method of claim 1 , wherein the first plurality of dummy stacked structures comprise a plurality of portions in one of the plurality of low-k dielectric layers, and the plurality of portions are disconnected from each other.
3. The method of claim 1 further comprising:
forming an integrated circuit at a surface of the semiconductor substrate; and
forming a plurality of electrical connection structures electrically coupling to the integrated circuit, wherein the plurality of electrical connection structures are formed in same processes as the first plurality of dummy stacked structures and the second plurality of dummy stacked structures.
4. The method of claim 1 , wherein the first plurality of dummy stacked structures and the second plurality of dummy stacked structures are electrically floating.
5. The method of claim 1 , wherein the first plurality of dummy stacked structures and the second plurality of dummy stacked structures are spaced apart from the via opening by spacings smaller than about 1 μm.
6. The method of claim 1 , wherein the first plurality of dummy stacked structures extend to the semiconductor substrate.
7. The method of claim 1 , wherein bottoms of the first plurality of dummy stacked structures are higher than, and are spaced apart from, the semiconductor substrate.
8. The method of claim 1 , wherein the first plurality of dummy stacked structures form a plurality of rings, each fully encircling the via opening.
9. The method of claim 1 further comprising performing a baking process on a respective wafer comprising the via opening.
10. A method comprising:
forming a plurality of low-k dielectric layers over a semiconductor substrate;
forming a first plurality of dummy stacked structures extending into at least one of the plurality of low-k dielectric layers;
forming a plurality of non-low-k dielectric layers over the plurality of low-k dielectric layers;
forming a second plurality of dummy stacked structures extending into the plurality of non-low-k dielectric layers, wherein the second plurality of dummy stacked structures are over and connected to corresponding ones of the first plurality of dummy stacked structures, wherein the first plurality of dummy stacked structures comprise a plurality of portions in the at least one of the plurality of low-k dielectric layers, and the plurality of portions are disconnected from each other;
etching the plurality of non-low-k dielectric layers, the plurality of low-k dielectric layers, and the semiconductor substrate to form a via opening, wherein the via opening is encircled by the first plurality of dummy stacked structures and the second plurality of dummy stacked structures; and
filling the via opening to form a through-via.
11. The method of claim 10 further comprising:
forming an integrated circuit at a surface of the semiconductor substrate; and
forming a plurality of electrical connection structures electrically coupling to the integrated circuit, wherein the plurality of electrical connection structures are formed in same processes as the first plurality of dummy stacked structures and the second plurality of dummy stacked structures.
12. The method of claim 10 , wherein the first plurality of dummy stacked structures and the second plurality of dummy stacked structures are electrically floating.
13. The method of claim 10 , wherein the first plurality of dummy stacked structures and the second plurality of dummy stacked structures are spaced apart from the via opening by spacings smaller than about 1 μm.
14. The method of claim 10 , wherein the first plurality of dummy stacked structures are electrically coupled to the semiconductor substrate.
15. The method of claim 10 , wherein the first plurality of dummy stacked structures are aligned to a plurality of rings, each fully encircling the via opening.
16. A method comprising:
forming a plurality of low-k dielectric layers over a semiconductor substrate;
forming a first plurality of dummy stacked structures extending into at least one of the plurality of low-k dielectric layers;
forming a plurality of non-low-k dielectric layers over the plurality of low-k dielectric layers;
forming a second plurality of dummy stacked structures extending into the plurality of non-low-k dielectric layers, wherein the second plurality of dummy stacked structures are over and connected to corresponding ones of the first plurality of dummy stacked structures, wherein in a top view of the second plurality of dummy stacked structures, neighboring ones of the second plurality of dummy stacked structures are separated from each other by a substantially uniform spacing;
etching the plurality of non-low-k dielectric layers, the plurality of low-k dielectric layers, and the semiconductor substrate to form a via opening, wherein the via opening is encircled by the first plurality of dummy stacked structures and the second plurality of dummy stacked structures; and
filling the via opening to form a through-via, wherein in the top view, first ones of the second plurality of dummy stacked structures are aligned to a first ring that encircling the through-via.
17. The method of claim 16 , wherein in the top view, second ones of the second plurality of dummy stacked structures are aligned to a second ring that encircles the first ring.
18. The method of claim 16 , wherein the first plurality of dummy stacked structures and the second plurality of dummy stacked structures are electrically floating.
19. The method of claim 16 , wherein the first plurality of dummy stacked structures are electrically coupled to the semiconductor substrate.
20. The method of claim 16 , wherein bottoms of the first plurality of dummy stacked structures are higher than, and are spaced apart from, the semiconductor substrate.