Patent Assignment
Reel/Frame 057383/0333
Assignment of Assignor's Interest
Recorded: 2021-09-03
Pages: 5
Assignors
TSAI, CHEN-HUNG
Executed: 2021-06-21
WANG, CHAO-HSUN
Executed: 2021-06-21
LEE, PEI-HSUAN
Executed: 2021-06-21
CHI, CHIH-CHIEN
Executed: 2021-06-21
CHANG, TING-KUI
Executed: 2021-07-26
YANG, FU-KAI
Executed: 2021-06-24
WANG, MEI-YUN
Executed: 2021-06-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Forming Liners to Facilitate The Formation of Copper-Containing Vias in Advanced Technology Nodes