Patent Assignment
Reel/Frame 057387/0606
Assignment of Assignor's Interest
Recorded: 2021-09-03
Pages: 4
Assignors
CHENG, MING
Executed: 2021-07-23
JIN, XING
Executed: 2021-07-23
LI, RAN
Executed: 2021-07-23
Assignee
CHANGXIN MEMORY TECHNOLOGIES, INC.
NO. 388, XINGYE AVENUE, AIRPORT INDUSTRIAL PARK, ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA, HEFEI, ANHUI, 230000, CHINA
Covered Property
(1)
Semiconductor Structure with Void and Manufacturing Method Thereof