Semiconductor structure with void and manufacturing method thereof
A method for manufacturing a semiconductor structure includes: providing a substrate and a bit line structure located on the substrate, the bit line structure including a top dielectric layer and capacitive contact holes being provided on two opposite sides of the bit line structure; forming a first spacer covering a sidewall of the top dielectric layer between the bit line structure and the capacitive contact hole and a second spacer covering a sidewall of the first spacer, a top surface of the second spacer being higher than that of the first spacer; removing at least part of the top dielectric layer to form a first void; forming a first sealing film by a deposition process; and removing a part of the first sealing film which is higher than the top surface of the second spacer, the remaining first sealing film is a first sealing layer.
1 . A semiconductor structure, comprising:
a substrate, bit line structures disposed on the substrate, and capacitive contact holes arranged on opposite sides of each of the bit line structures;
first spacers, each of the first spacers disposed between each of the bit line structures and each of the capacitive contact holes;
voids, each of the voids arranged between the first spacers on the opposite sides of each of the bit line structures; and
sealing layers, each of the sealing layers covering a top surface of each of the first spacers and plugging a top opening of each of the voids, a thickness of each of the sealing layers on each of the first spacers being more than or equal to 30 nm in a direction perpendicular to the substrate; wherein each of the voids comprises a first void arranged between two opposite capacitive contact holes and a second void disposed between two first voids of the adjacent voids in an extending direction of the bit line structures;
the semiconductor structure further comprising isolation layers, each of the isolation layers disposed on the opposite sides of each of the bit line structures and configured to isolate adjacent capacitive contact holes, wherein the second void is arranged between two opposite isolation layers.
2 . The semiconductor structure of claim 1 , wherein each of the sealing layers comprises a first sealing layer configured to plug the first void and a second sealing layer configured to plug the second void.
3 . The semiconductor structure of claim 1 , wherein a top surface of the first void is higher than a top surface of the second void in a direction perpendicular to a surface of the substrate.
4 . The semiconductor structure of claim 1 , wherein a thickness of each of the voids is less than or equal to 80 nm in a direction perpendicular to a surface of the substrate.