Semiconductor device and method for fabricating the same
A method for fabricating semiconductor device includes the steps of: providing a substrate having a cell region and a peripheral region; forming a bit line structure on the cell region and a gate structure on the peripheral region; forming an interlayer dielectric (ILD) layer around the bit line structure and the gate structure; forming a conductive layer on the bit line structure; performing a first photo-etching process to remove part of the conductive layer for forming storage contacts adjacent two sides of the bit line structure and contact plugs adjacent to two sides of the gate structure; forming a first cap layer on the cell region and the peripheral region to cover the bit line structure and the gate structure; and performing a second photo-etching process to remove part of the first cap layer on the cell region.
1. A semiconductor device, comprising:
a substrate having a cell region and a peripheral region;
a bit line structure on the cell region;
air gaps adjacent to two sides of the bit line structure;
a first cap layer on the bit line structure and the air gaps, wherein the first cap layer is U-shaped; and
a second cap layer on the first cap layer, wherein the second cap layer and the first cap layer comprise a dielectric material.
2. The semiconductor device of claim 1 , further comprising storage contacts adjacent to two sides of the bit line structure.
3. The semiconductor device of claim 2 , wherein a top surface of the storage contacts is even with the top surfaces of the first cap layer and the second cap layer.
4. The semiconductor device of claim 2 , wherein the storage contacts comprise tungsten.
5. The semiconductor device of claim 1 , further comprising:
a gate structure on the peripheral region;
an interlayer dielectric (ILD) layer on the gate structure; and
contact plugs adjacent to two sides of the gate structure and within the ILD layer.
6. The semiconductor device of claim 1 , wherein the first cap layer and the second cap layer comprise different material.
7. The semiconductor device of claim 1 , wherein the first cap layer comprises silicon nitride.
8. The semiconductor device of claim 1 , wherein the second cap layer comprises silicon carbon nitride (SiCN).