Patent Assignment
Reel/Frame 057405/0028
Assignment of Assignor's Interest
Recorded: 2021-09-08
Pages: 4
Assignor
NIHEI, HIDEHARU
Executed: 2021-07-26
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Bonding Apparatus and Bonding Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.