Patent Assignment
Reel/Frame 057423/0186
Assignment of Assignor's Interest
Recorded: 2021-09-09
Pages: 5
Assignors
KANEKO, TADAAKI
Executed: 2021-04-30
ASHIDA, KOJI
Executed: 2021-05-15
IHARA, TOMOYA
Executed: 2021-05-09
DOJIMA, DAICHI
Executed: 2021-04-30
Assignees
KWANSEI GAKUIN EDUCATIONAL FOUNDATION
1-155, UEGAHARA-ICHIBAN-CHO, NISHINOMIYA-SHI, HYOGO, 6628501, JAPAN
TOYOTA TSUSHO CORPORATION
9-8, MEIEKI 4-CHOME, NAKAMURA-KU, NAGOYA, 4508575, JAPAN
Covered Property
(1)
Sic Semiconductor Substrate, Method for Manufacturing Same, and Device for Manufacturing Same