Patent Assignment
Reel/Frame 057425/0458
Assignment of Assignor's Interest
Recorded: 2021-09-07
Pages: 3
Assignors
BAIK, SEUNG IN
Executed: 2021-06-18
CHUN, HEE SUN
Executed: 2021-06-18
PARK, JAE SUNG
Executed: 2021-06-17
KIM, HYOUNG UK
Executed: 2021-06-18
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Ceramic Electronic Component