Patent Assignment
Reel/Frame 057445/0283
Assignment of Assignor's Interest
Recorded: 2021-09-10
Pages: 9
Assignors
LEE, HUNTEAK
Executed: 2021-09-10
KIM, GWANG
Executed: 2021-09-10
YE, JUNHO
Executed: 2021-09-10
CHOI, YOUJOUNG
Executed: 2021-09-10
KIM, MINKYUNG
Executed: 2021-09-10
LEE, YOUNGWOO
Executed: 2021-09-10
KIM, NAMGU
Executed: 2021-09-10
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Semiconductor Package with RF Antenna Interposer Having High Dielectric Encapsulation
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the 6TH Inventor's Name Previously Recorded at Reel: 057445 Frame: 0283. Assignor(S) Hereby Confirms the Assignment .
Jan 12, 2022
From: LEE, HUNTEAK; KIM, GWANG; YE, JUNHO; CHOI, YOUJOUNG
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 058703/0630 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →