IP Library › Assignment 058703/0630
Patent Assignment
Reel/Frame 058703/0630

Corrective Assignment to Correct the 6TH Inventor's Name Previously Recorded at Reel: 057445 Frame: 0283. Assignor(S) Hereby Confirms the Assignment .

Recorded: 2022-01-12 Pages: 10
Assignors
LEE, HUNTEAK
Executed: 2021-09-10
KIM, GWANG
Executed: 2021-09-10
YE, JUNHO
Executed: 2021-09-10
CHOI, YOUJOUNG
Executed: 2021-09-10
KIM, MINKYUNG
Executed: 2021-09-10
LEE, YONGWOO
Executed: 2022-01-12
KIM, NAMGU
Executed: 2021-09-10
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property (1)
Semiconductor Device and Method of Forming Semiconductor Package with RF Antenna Interposer Having High Dielectric Encapsulation
Application: 17/447,336 →
Publication: US 2023/0081706
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 10, 2021
From: LEE, HUNTEAK; KIM, GWANG; YE, JUNHO; CHOI, YOUJOUNG
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 057445/0283 →
Assignment of Assignor's Interest Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →