Patent Assignment
Reel/Frame 057467/0375
Assignment of Assignor's Interest
Recorded: 2021-09-13
Pages: 12
Assignors
DENG, CHAOJUN
Executed: 2021-09-09
WEI, XIAOYUN
Executed: 2021-09-09
YANG, YONG
Executed: 2021-09-03
XU, JIYE
Executed: 2021-09-03
FU, XING
Executed: 2021-09-03
Assignee
HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT, SHENZHEN, GUANGDONG, 518129, CHINA
Covered Property
(1)
Chip and Manufacturing Method Thereof, and Electronic Device