Patent Assignment
Reel/Frame 057468/0232
Assignment of Assignor's Interest
Recorded: 2021-09-10
Pages: 5
Assignors
CHOI, HYUNG JONG
Executed: 2021-04-19
LEE, YOO JEONG
Executed: 2021-04-19
SON, KWAN YOUNG
Executed: 2021-04-19
SUNG, WOO KYUNG
Executed: 2021-04-19
PARK, KYU SIK
Executed: 2021-04-19
PARK, MYUNG JUN
Executed: 2021-04-19
WON, KWANG YEUN
Executed: 2021-04-19
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayered Electronic Component and Method of Manufacturing the Same