Multilayered electronic component and method of manufacturing the same
A multilayer electronic component according to an embodiment of the present disclosure includes: an electronic component body including a body having a dielectric layer and an internal electrode, and an external electrode disposed on the body; and a coating layer disposed on an external surface of the electronic component body, including one or more of silicon (Si) and fluorine (F), and having an average thickness of 5 nm or more and 15 nm or less.
1. A multilayer electronic component, comprising:
an electronic component body including a body having a dielectric layer and an internal electrode; and an external electrode disposed on the body, and
a coating layer disposed on an external surface of the electronic component body, and containing one or more of a silicone-based hydrocarbon compound and a fluorine-based hydrocarbon compound, the coating layer having an average thickness of 5 nm or more and 15 nm or less,
wherein the body comprises a capacitance formation portion in which the dielectric layer and the internal electrode are alternately disposed, a cover portion disposed above and below the capacitance formation portion, and a margin portion disposed on both side surfaces of the capacitance formation portion,
one or more of the cover portion and the margin portion comprise a pore extending from an external surface of the body towards the capacitance formation portion, and
the coating layer extends from the external surface of the electronic component body onto a side surface of the pore, while not covering a central portion the pore on a level of the external surface of the electronic component body.
2. The multilayer electronic component of claim 1 , wherein the coating layer has a maximum thickness of 20 nm or less.
3. The multilayer electronic component of claim 1 , wherein the coating layer has a contact angle of 100 degrees or more with water.
4. The multilayer electronic component of claim 1 , wherein the coating layer is disposed to contact an external surface of the external electrode, and is disposed to contact a region of an external surface of the body in which the external electrode is not disposed.
5. The multilayer electronic component of claim 1 , wherein the external electrode comprises an electrode layer disposed on the body and a plating layer disposed on the electrode layer.
6. The multilayer electronic component of claim 5 , wherein the coating layer is disposed to contact an external surface of the plating layer, and is disposed to contact a region of an external surface of the body in which the external electrode is not disposed.
7. The multilayer electronic component of claim 1 ,
wherein coating layer extends along the side surface of the pore to contact the internal electrode in the capacitance formation portion.
8. The multilayer electronic component of claim 1 , wherein a thickness of the dielectric layer is 0.5 μm or less.
9. The multilayer electronic component of claim 1 , wherein a thickness of the internal electrode is 0.5 μm or less.
10. The multilayer electronic component of claim 1 , wherein the coating layer is in contact with the external electrode and the body.
11. The multilayer electronic component of claim 10 , wherein the external electrode comprises an electrode layer disposed on the body and a plating layer disposed on the electrode layer, and
the coating layer covers and is in contact with the plating layer.
12. The multilayer electronic component of claim 1 ,
wherein the one or more of the cover portion and the margin portion further comprise another pore, and
the coating layer seals the another pore.
13. A method of manufacturing a multilayer electronic component, comprising operations of:
irradiating O 2 plasma on an external surface of an electronic component body to form an —OH functional group on the external surface of the electronic component body;
after irradiating the O 2 plasma, immersing the electronic component body including a body having a dielectric layer and an internal electrode, and an external electrode disposed on the body in a solution containing one or more of silane-based and fluorine-based compounds;
washing the immersed electronic component body; and
drying and curing the washed electronic component body to form a coating layer on the external surface of the electronic component body, the coating layer containing one or more of silicon (Si) and fluorine (F) and having an average thickness of 5 nm or more and 15 nm or less.
14. The method of manufacturing a multilayer electronic component of claim 13 , wherein the coating layer comprises one or more of a silicone-based hydrocarbon compound and a fluorine-based hydrocarbon compound.