Patent Assignment
Reel/Frame 057468/0816
Assignment of Assignor's Interest
Recorded: 2021-09-10
Pages: 14
Assignors
JUN, KIMIN
Executed: 2021-08-20
EID, FERAS
Executed: 2021-09-07
ELSHERBINI, ADEL
Executed: 2021-08-18
ALEKSOV, ALEKSANDAR
Executed: 2021-08-18
LIFF, SHAWNA
Executed: 2021-09-09
SWAN, JOHANNA
Executed: 2021-09-09
SEBOT, JULIEN
Executed: 2021-09-06
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Device, Method and System to Mitigate Stress on Hybrid Bonds in a Multi-Tier Arrangement of Chiplets