Patent Assignment
Reel/Frame 057468/0901
Assignment of Assignor's Interest
Recorded: 2021-09-13
Pages: 9
Assignors
YOHANNES, DANIEL
Executed: 2019-10-11
AMPARO, DENIS
Executed: 2019-10-11
CHERNYASHEVSKYY, OLEKSANDR
Executed: 2019-10-11
MUKHANOV, OLEG
Executed: 2019-10-11
RENZULLO, MARIO
Executed: 2019-10-11
VIVALDA, JOHN
Executed: 2019-10-11
TALALAEVSKII, ANDREI
Executed: 2019-10-17
VERNICK, IGOR
Executed: 2019-10-11
WALTER, JASON
Executed: 2019-10-11
Assignee
SEEQC, INC.
150 CLEARBROOK ROAD, 150, ELMSFORD, NEW YORK, 10523
Covered Properties
(3)
System and Method for Superconducting Multi-Chip Module
System and Method for Superconducting Multi-Chip Module
System and Method for Superconducting Multi-Chip Module
Application:
62/744,494 →
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 7, 2019
From: HYPRES, INC.
To: SEEQC,INC.
Reel/Frame 049412/0196 →
Assignment of Assignor's Interest
Dec 31, 2025
From: YOHANNES, DANIEL, DR.; AMPARO, DENIS, DR.; CHERNYASHEVSKYY, OLEKSANDR, DR.; MUKHANOV, OLEG, DR.
To: SEEQC INC.
Reel/Frame 073341/0530 →
Assignment of Assignor's Interest
Dec 31, 2025
From: HYPRES, INC.
To: SEEQC INC.
Reel/Frame 074160/0792 →