IP Library Assignment 073341/0530
Patent Assignment
Reel/Frame 073341/0530

Assignment of Assignor's Interest

Recorded: 2025-12-31 Pages: 9
Assignors
YOHANNES, DANIEL, DR.
Executed: 2019-11-13
AMPARO, DENIS, DR.
Executed: 2019-10-11
CHERNYASHEVSKYY, OLEKSANDR, DR.
Executed: 2019-10-11
MUKHANOV, OLEG, DR.
Executed: 2019-10-11
RENZULLO, MARIO, DR.
Executed: 2019-10-11
VIVALDA, JOHN, DR.
Executed: 2019-10-11
TALALAEVSKII, ANDREI, DR.
Executed: 2019-10-17
VERNIK, IGOR, DR.
Executed: 2019-10-11
WALTER, JASON, DR.
Executed: 2019-10-11
Assignee
SEEQC INC.
150 CLEARBOOK ROAD, ELMSFORD, NEW YORK, 10523
Covered Properties (4)
System and Method for Superconducting Multi-Chip Module
Application: 62/744,494 →
System and Method for Superconducting Multi-Chip Module
Application: 16/599,985 →
Publication: US 2020/0119251
System and Method for Superconducting Multi-Chip Module
Application: 17/472,821 →
Publication: US 2021/0408355
System and Method for Superconducting Multi-Chip Module
Application: 18/357,814 →
Publication: US 2023/0380302
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 7, 2019
From: HYPRES, INC.
To: SEEQC,INC.
Reel/Frame 049412/0196 →
Assignment of Assignor's Interest Sep 13, 2021
From: YOHANNES, DANIEL; AMPARO, DENIS; CHERNYASHEVSKYY, OLEKSANDR; MUKHANOV, OLEG
To: SEEQC, INC.
Reel/Frame 057468/0901 →
Assignment of Assignor's Interest Dec 31, 2025
From: HYPRES, INC.
To: SEEQC INC.
Reel/Frame 074160/0792 →