IP Library › Assignment 057469/0359
Patent Assignment
Reel/Frame 057469/0359

Assignment of Assignor's Interest

Recorded: 2021-09-13 Pages: 3
Assignors
CHENG, CHUNG-LIANG
Executed: 2021-05-25
WANG, SHENG-TSUNG
Executed: 2021-05-25
CHAO, HUANG-LIN
Executed: 2021-05-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Gate Contact and via Structures in Semiconductor Devices
Application: 17/470,548 →
Publication: US 2022/0254927