Assignment of Assignor's Interest

Recorded: 2021-09-07 Pages: 6

Assignors

FUJII, NOBUTOSHI

Executed: 2014-01-31

HAGIMOTO, YOSHIYA

Executed: 2014-02-05

AOYAGI, KENICHI

Executed: 2014-01-31

KAGAWA, YOSHIHISA

Executed: 2014-02-05

Assignee

SONY CORPORATION

1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN

Covered Property (1)

Bonded Semiconductor Devices with Jagged-Shaped Bonding Interface

Application: 17/392,733 →

Publication: US 2021/0366958

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.