Patent Assignment
Reel/Frame 057538/0224
Change of Name
Recorded: 2021-09-17
Pages: 7
Assignor
SONY CORPORATION
Executed: 2021-04-01
Assignee
SONY GROUP CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
Covered Properties
(28)
Image Pickup Device and Electronic Apparatus
Semiconductor Device, Manufacturing Method of Semiconductor Device, Integrated Substrate, and Electronic Device
Application:
17/229,376 →
Publication:
US 2021/0233874
Image Pickup Device and Electronic Apparatus
Semiconductor Device, Solid-State Image Pickup Element, Image Pickup Device, and Electronic Apparatus
Composite Transistor with Electrodes Extending to Active Regions
Image Pickup Apparatus, Solid-State Image Pickup Device, and Control Method for Image Pickup Apparatus
Application:
17/324,972 →
Publication:
US 2021/0274114
Aroma Diffusing Device and Method of Controlling Aroma Diffusing Device
Complementary Transistor and Semiconductor Device
Solid-State Imaging Sensor
Solid-State Image Pickup Element, Method of Manufacturing Solid-State Image Pickup Element, and Electronic Apparatus
Projection Optical Systems and Methods Having Variable Diaphragm Based on Average Luminance and Grayscale
Image Display Device, Head-Mounted Display, Method for Manufacturing Image Display Device, and Method for Adjusting Image Display Device
Application:
17/282,979 →
Publication:
US 2021/0349317
Display Unit and Illumination Unit
Optical Device, Light Source Device, and Projector
Solid-State Imaging Device, Manufacturing Method Thereof, and Electronic Apparatus
Bonded Semiconductor Devices with Jagged-Shaped Bonding Interface
Application:
17/392,733 →
Publication:
US 2021/0366958
Solid-State Imaging Device and Electronic Apparatus
Semiconductor Device, Manufacturing Method for Semiconductor Device, and Electronic Device
Solid-State Image-Capturing Device and Production Method Thereof, and Electronic Appliance
Solid-State Imaging Device Having Through Electrode Provided Therein and Electronic Apparatus Incorporating the Solid-State Imaging Device
Solid-State Imaging Device, Method of Manufacturing the Same, and Electronic Apparatus
Solid-State Imaging Device and Imaging Apparatus
Solid-State Imaging Device, Signal Processing Method Therefor, and Electronic Apparatus for Enabling Sensitivity Correction
Semiconductor Device and Method for Production of Semiconductor Device
Semiconductor Device, Fabrication Process, and Electronic Device
Patent:
50,431 →
Application:
17/308,796 →
Solid State Imaging Device and Electronic Device
Semiconductor Device, Solid-State Image Pickup Element, Imaging Device, and Electronic Apparatus
Application:
17/229,231 →
Publication:
US 2021/0233946
Semiconductor Device and Imaging Device
Application:
17/357,327 →
Publication:
US 2021/0320141
Related Assignments
(19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 7, 2021
From: OISHI, HIDETOSHI; MATSUMOTO, KOICHI; TOMIDA, KAZUYUKI
To: SONY GROUP CORPORATION
Reel/Frame 055854/0412 →
Assignment of Assignor's Interest
Apr 29, 2021
From: NOMURA, HIROTOSHI
To: SONY CORPORATION
Reel/Frame 056975/0438 →
Assignment of Assignor's Interest
Aug 19, 2021
From: YAMAMOTO, YUICHI
To: SONY CORPORATION
Reel/Frame 057244/0789 →
Assignment of Assignor's Interest
Aug 19, 2021
From: YONEZAWA, TAKESHI
To: SONY CORPORATION
Reel/Frame 057230/0066 →
Assignment of Assignor's Interest
Aug 19, 2021
From: BIWA, GOSHI
To: SONY CORPORATION
Reel/Frame 057230/0321 →
Assignment of Assignor's Interest
Aug 19, 2021
From: AKIBA, AKIRA
To: SONY CORPORATION
Reel/Frame 057229/0856 →
Assignment of Assignor's Interest
Aug 20, 2021
From: MAEDA, YUKI
To: SONY CORPORATION
Reel/Frame 057240/0024 →
Assignment of Assignor's Interest
Aug 20, 2021
From: MATSUMOTO, KOICHI
To: SONY CORPORATION
Reel/Frame 057250/0139 →
Assignment of Assignor's Interest
Aug 23, 2021
From: ISHIWATA, HIROAKI; TANAKA, HARUMI; ANDO, ATSUHIRO
To: SONY CORPORATION
Reel/Frame 057255/0799 →
Assignment of Assignor's Interest
Aug 24, 2021
From: WAKIYAMA, SATORU; OKAMOTO, MASAKI; OOKA, YUTAKA; SHOHJI, REIJIROH
To: SONY CORPORATION
Reel/Frame 057268/0862 →
Assignment of Assignor's Interest
Aug 24, 2021
From: OGAWA, KOJI; SAKAKIBARA, MASAKI
To: SONY CORPORATION
Reel/Frame 057268/0634 →
Assignment of Assignor's Interest
Aug 24, 2021
From: MIYANAMI, YUKI
To: SONY CORPORATION
Reel/Frame 057270/0163 →
Assignment of Assignor's Interest
Aug 24, 2021
From: MASUDA, YOSHIAKI; ISHIDA, MINORU
To: SONY CORPORATION
Reel/Frame 057277/0629 →
Assignment of Assignor's Interest
Aug 24, 2021
From: NOUDO, SHINICHIRO
To: SONY CORPORATION
Reel/Frame 057278/0585 →
Assignment of Assignor's Interest
Aug 25, 2021
From: KONYA, SATOSHI; FUJITA, SHUJI
To: SONY CORPORATION
Reel/Frame 057283/0336 →
Assignment of Assignor's Interest
Aug 25, 2021
From: OSHIYAMA, ITARU; TANAKA, HIROSHI
To: SONY CORPORATION
Reel/Frame 057298/0292 →
Assignment of Assignor's Interest
Aug 25, 2021
From: MIYATA, SATOE; OSHIYAMA, ITARU
To: SONY CORPORATION
Reel/Frame 057282/0024 →
Corrective Assignment to Correct the Receiving Party Name Previously Recorded at Reel: 55864 Frame: 412. Assignor(S) Hereby Confirms the Assignment.
Aug 31, 2021
From: OISHI, HIDETOSHI; MATSUMOTO, KOICHI; TOMIDA, KAZUYUKI
To: SONY CORPORATION
Reel/Frame 057392/0458 →
Assignment of Assignor's Interest
Sep 7, 2021
From: FUJII, NOBUTOSHI; HAGIMOTO, YOSHIYA; AOYAGI, KENICHI; KAGAWA, YOSHIHISA
To: SONY CORPORATION
Reel/Frame 057471/0359 →